Comprehensive Package Solution
Design & Validation
Full-stack packaging development: In-house design/simulation/substrate integration
Cross-functional co-simulation: Joint SI/PI/thermal/mechanical analysis with client PCB ecosystems
SI/PI, Thermal and Mechanical Simulation
Signal integrity optimization
Thermal management modeling
Power delivery validation
Structural reliability simulation
Qualification Infrastructure
Production ATE: 93K & UltraFlex™ platforms
Temperature-controlled testing: Active Thermal Control systems
Interface validation: ATE-integrated SerDes/DDR test solutions